HEATBIND™

The HEATBIND™ patent pending technology achieves the highest effective area of thermal interface between card and chassis for conduction cooled embedded computing applications.

 

HEATBIND™ achieves a higher area of thermal interface with a single junction between the monoblock frame and the solid retainer thereby reducing the thermal resistance of the system making it superior in performance to wedgelocks, ICE-LOKs or any other open or patented retainer technology.

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The driving screw, has dual action onto the HEATBIND™ solid retainer:  it pushes the retainer to lock and it pulls the retainer to unlock. Wedgelocks do not feature the push-pull action and consequently tend to remain wedged in the locked state even if the locking screw is loosen.

 

HEATBIND™ is suitable for Open VPX, Space VPX, Open SOSA, Compact PCI Serial and Compact PCI Serial Space applications.

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We welcome any inquiry and we are glad to adapt HEATBIND™ to any card top frame or bottom frame configuration in both 3U and 6U designs.