PERFORMANCE INTERCONNECT
HEATBIND™
Good-bye wedgelocks, HELLO HEATBIND!
The HEATBIND™ patent pending technology achieves the highest effective area of thermal interface between card and chassis for conduction cooled embedded computing applications.
HEATBIND™ achieves a higher area of thermal interface with a single junction between the monoblock frame and the solid retainer thereby reducing the thermal resistance of the system making it superior in performance to wedgelocks, ICE-LOKs or any other open or patented retainer technology.
The driving screw, has dual action onto the HEATBIND™ solid retainer: it pushes the retainer to lock and it pulls the retainer to unlock. Wedgelocks do not feature the push-pull action and consequently tend to remain wedged in the locked state even if the locking screw is loosen.
HEATBIND™ is suitable for Open VPX, Space VPX, Open SOSA, Compact PCI Serial and Compact PCI Serial Space applications.
We welcome any inquiry and we are glad to adapt HEATBIND™ to any card top frame or bottom frame configuration in both 3U and 6U designs.
Vibration and Shock
qualification levels and duration:
• Random vibration per MIL-STD-810H, VITA 47.1 Section 4.4.3 (Vibration Class V3), in 3-Axis, each: 12 Grms for 30 minutes, 17.5 Grms for 15 minutes, 22 Grms for 15 minutes, 25 Grms for 15 minutes.
• Sinusoidal sweep vibration at 10G peak 5-2000 Hz for 10 minutes/axis per IAW MIL-STD-810H.
• Shock Vibration per IAW MIL-STD-810H Method 516.8, Figure 516.8-5. 40G, 11msec Half sine shock pulses in 3 positive and 3 negative hits.
Conclusion: PASSED.
Following test exposure, there was no evidence of module movement. In addition, there is no indication of rotation/loss of preload in the two drive mechanism fasteners. The drive mechanism had no signs of torque relaxation. In addition, the unit was marked on the top of the heat plate adjacent to the fixture rails prior to following test exposure and no indication of movement was observed. Also, detailed inspection of the unit indicates no evidence of fretting on unit top side and bottom side of the conduction rails surfaces. Following vibration exposure, the HEATBIND driver mechanisms exhibited smooth operation in clockwise and counterclockwise directions of rotation.
Testing was conducted on 29/11/2024 at PARAGON SYSTEMS, 18, Basaltic Road, Concord, ON, Canada, L4K 1G6
(accredited facility in accordance with A2LA 1942.01)
Thermal Test Report:
Test date and facility:
Testing was conducted on 07/01/2025 at Wolf Advanced Technology, 175 Mostar Street, STE 200, Stouffville, ON, Canada.
Test method:
Conducted in accordance with the VITA 47.1 - 2019 standard, a recognized guideline for thermal testing in the industry.
Test conditions:
Test units were subjected to thermal testing under room temperature conditions using a liquid-cooled test fixture.
Testing was conducted at two GPU power levels (90W and 120W).
DUT 1: 3U VPX copper card with Wavetherm SW5-43-270-250-M25-BA-30D
locked with installation torque of up to 1.24 Nm.
DUT 2: 3U VPX copper card with HEATBIND solid retainers part numbers RPLU1110ZZB and RPRU1110ZZB
locked with installation torque of up to 1.3 Nm.
Test conclusion:
The unit employing HEATBIND retainers offers good thermal performance in dry interface conditions.
Test results:
