PERFORMANCE INTERCONNECT
PHENOMENA™ TIM AND Cu-Di COMPOSITE
Advanced Diamond Composite Thermal Materials
PHENOMENA™ is the ultimate expression of performance in thermally conductive composite materials based on high volumetric diamond content. Among all materials in nature, diamond has the highest thermal conductivity.
The PHENOMENA™ I - Thermal Interface Paste is used to connect processors to heat spreaders or to heat plates. This special paste has an ultra-high concentration of highly diffusive micro and nano particles with specially formulated CVD coating, designed to achieve sustained thermal wave propagation by improved energy band matching between phonon and free-electron thermal transfer mechanisms. The conductive diamond particles are bound into a high-performance siloxane compound compatible with high vacuum applications.
The PHENOMENA™ II - Copper-Diamond (CuDi) Composite Alloy is a superlative advancement in material technology. The material displays nearly "magic" thermal conductivity performance and is an extraordinary solution in conduction cooling applications regardless of their environment. It works with equal effectiveness under extreme G forces and under the harsh conditions of deep space in total absence of gravity.
The PHENOMENA™ CuDi composite alloy is a space saving, mass saving, high thermal conductivity solution for embedded computing systems employing high-power semiconductor devices such as GPUs and FPGAs. The PHENOMENA™ CuDi alloy is used to make custom heat spreaders and heat plates.
PHENOMENA I – THERMAL INTERFACE PASTE – CHARACTERISTICS:
Thermal conductivity (calculated): >20W/mxK
Electrical resistance: >1MΩ/1cm^2 @1mm gap
Operating temperature: -55ºC to +200ºC
TML /evaporation: 0.06% @ +200ºC
Saturated vapor pressure: 6.0 x10^-7 kPa, 60ºC≤
Corrosion test C10200: 100ºC, 3hours, passed
Compatible in vacuum to 6.0 x 10^-7 kPa
Dropping point ≥300ºC
Handling precautions: Do not ingest, do not allow contact with eyes
Hazardous ingredients: no hazard
Cleaning: Clean with alcohol
PHENOMENA II – CuDi Composite Alloy – Mechanical Properties
Flexural Strength: The ability of the material to resist load forces.
Ranges from 300 to 500 MPa.
Tensile Strength: The ability of the material to resist tensile forces.
Since diamond particles are hard and brittle phases, tensile strength testing is not representative.
Yield Strength: The stress value at which the material begins to undergo plastic deformation.
Diamond-copper composite materials are brittle and do not exhibit yield strength.
Elongation: An indicator of ductility, representing the maximum extent of stretching before fracture.
Diamond-copper composite materials are brittle and do not exhibit ductility.
Hardness: The ability to resist indentation.
The hardness of diamond copper composites is influenced by the volume concentration of diamond in the material. Diamond’s Vickers hardness (HV) typically ranges between 7000 - 9000 HV (theoretical value), which is significantly higher than that of pure copper (approximately 30 -100 HV). The hardness of the material is not uniform, it exhibits a composite characteristic of high hardness in the diamond phase + high toughness in the copper phase. The copper phase primarily serves as a binder.
Fatigue Strength: The ability to withstand cyclic loading.
No testing has been conducted. Diamond-copper materials primarily focus on thermo-physical properties and interfacial bonding performance.
PHENOMENA II – CuDi Composite Alloy – Physical Properties
Density: 5 to 6 g/cm3
Melting point: The melting point of the CuDi composite material is based on the matrix copper melting point, which is above 1083°C.
Coefficient of thermal expansion: 5.0 ≤ CTE ≤ 7.2 x 1/(Kx106) from 20ºC to 200ºC
Thermal conductivity: The composite material Tc ranges from 700 – 800 W/mxK depending on thickness.
Tc attenuation: <5% after 1000 cycles from -55ºC to 175ºC, measured in % of W/mxK.
Electrical conductivity: Primarily determined by the copper matrix and varies with the volume concentration of diamond. The current product has a volume electrical conductivity of approximately 200 S/m, which is about one-third that of pure copper.
